IC Assembly

The “Microcontract” company group offers its customers the services for contract assembly of IC chips, including the die preparation, packaging and electrical connection of IC pads with package leads. All stages of the technological process are performed on up-to-date automatic equipment. Our assembly line supports the following operations:- wafer thinning before dicing

- wafer saw dicing, known-good die choosing according to customer provided map

- wire bonding (Au or Cu, Al)

- bump formation

- die assembling on package or PCB with using adhesive or solder

- packaging with using of epoxy molding compound

- “Dam-and-Fill” packaging

- LED die packaging with optically transparent silicone

- lid sealing with adhesive, solder or solder preform

- ball mounting for BGA packages

- flip-chip underfilling

 

IC Assembly

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